半导体
offering product urn:matchory:offering:01m772emdse9jtsxdc1y91mmka
Offered by BYD COMPANY LIMITED urn:matchory:entity:01m772ekadfx29vd7atdtcg8f2 (entity). Relation: not stated. Commodity: none confirmed.
An offering's identity is its owner, its commodity and its normalised name; it is never merged with another supplier's.
Facts
| Attribute | Value as written | Producer | Evidence | Observed | Status |
|---|---|---|---|---|---|
| Name as stated name | 半导体 | products products 2 | 半导体https://www.bydglobal.com/cn/yangwang |
2026-11-12 | current |
| Name as stated name | 半导体 | extraction extract 3 | 半导体https://www.bydglobal.com/cn/environmental-information |
2026-11-12 | current |
| UNSPSC classification unspsc | no code (16 candidates considered) | classification unspsc 3 | 2026-11-12 | current |